JPH0531838B2 - - Google Patents
Info
- Publication number
- JPH0531838B2 JPH0531838B2 JP1762086A JP1762086A JPH0531838B2 JP H0531838 B2 JPH0531838 B2 JP H0531838B2 JP 1762086 A JP1762086 A JP 1762086A JP 1762086 A JP1762086 A JP 1762086A JP H0531838 B2 JPH0531838 B2 JP H0531838B2
- Authority
- JP
- Japan
- Prior art keywords
- rigid
- substrate
- flexible substrate
- flexible
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 174
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 238000005520 cutting process Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 7
- 239000009719 polyimide resin Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 5
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 4
- 239000005062 Polybutadiene Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 229920002857 polybutadiene Polymers 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 2
- 230000009969 flowable effect Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 230000002411 adverse Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1762086A JPS62174996A (ja) | 1986-01-28 | 1986-01-28 | リジツド・フレキシブル配線板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1762086A JPS62174996A (ja) | 1986-01-28 | 1986-01-28 | リジツド・フレキシブル配線板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62174996A JPS62174996A (ja) | 1987-07-31 |
| JPH0531838B2 true JPH0531838B2 (en]) | 1993-05-13 |
Family
ID=11948913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1762086A Granted JPS62174996A (ja) | 1986-01-28 | 1986-01-28 | リジツド・フレキシブル配線板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62174996A (en]) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH031555U (en]) * | 1989-05-29 | 1991-01-09 | ||
| JPH0377393A (ja) * | 1989-08-21 | 1991-04-02 | Ok Print:Kk | 配線基板装置 |
| JPH1056266A (ja) * | 1996-08-12 | 1998-02-24 | Sony Corp | 複合配線基板の製造方法 |
| US6477284B1 (en) | 1999-06-14 | 2002-11-05 | Nec Corporation | Photo-electric combined substrate, optical waveguide and manufacturing process therefor |
| CN102595807B (zh) * | 2012-02-29 | 2014-10-15 | 博罗县精汇电子科技有限公司 | 软硬结合电路板的生产工艺 |
| CN111447726B (zh) * | 2020-03-31 | 2021-10-08 | 深圳市景旺电子股份有限公司 | 用于套装的刚挠结合板及制作方法 |
| CN117677030A (zh) * | 2022-09-06 | 2024-03-08 | 健鼎（无锡）电子有限公司 | 具有揭盖开口的半弯折印刷电路板 |
-
1986
- 1986-01-28 JP JP1762086A patent/JPS62174996A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62174996A (ja) | 1987-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |